Silver Solder Clay-Bond Plus™

Silver Solder Clay-Bond Plus™

Use like a paste to bond various metal clay and other metal parts together. Clay-Bond is used to join 2 flat surfaces and fired in activated carbon.

Clay-Bond is a silver-containing product used for joining silver, bronze, copper, and brass articles, whether they have been formed from metal clay or stamped sheet.

It is a powder that contains not only silver, flux, and other proprietary ingredients, but also a binder. When it is mixed with water it forms a paste that is used to lightly cement articles together in a desired configuration before heating the paste to accomplish the join. This ability to hold the items to be joined in a desired configuration is a unique feature because the items do not need to be held in position by external means, such as by hand, a fixture, or jig.

Because the items to be joined are held in place by the dried paste, many articles can be pre-arranged before heating so that soldering can be done in quantity. For example, a dozen pairs of earring posts can be joined to earrings in one easy operation quickly and easily without requiring skill with a torch or soldering iron.

Soldering is accomplished by heating in a kiln for a prescribed time, followed by air cooling. Alternately, and if desired, individual items can be joined by heating with a torch. After firing the solder forms a strong joint suitable for all jewelry-related applications.

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